No, they're regular LPDDR dice from one of the big manufacturers that are mounted on the same package as the SoC.
calf 3 minutes ago [-]
Is there a citation for this? I've found that the majority of Google searches tend to gloss over this hardware detail.
calf 4 minutes ago [-]
This question bothers me because I have never found a clear authoritative documentation.
The more detailed sources say, contra the mainstream impression, that Apple Silicon unified memory is technically a hybrid System-on-Chip and System-in-Package architecture. The memory banks DRAM are on a second die (one source said it is made by Samsung), but the RAM controller sits on the CPU die and manages the RAM for the unified memory pool for graphics/main/neural memory usage. Both IC dies coexists on a shared enclosed package as a single microchip. Technically this is still called a System-on-Chip architecture according to Wikipedia because the definition allows for parts, such as RAM or I/O, to still exist separately off the main piece of silicon die.
I have tried several times to find citations about this but it is a point that is often glossed over.
dzonga 1 hours ago [-]
so what have consumers gained from the 'A.I' boom ?
kids missing out on games - cz Switch prices went up.
regular joes - consumer hardware went up at least 50% from RAM, SSDs & other components
I guess regular joes gained the ability to 'chat' with a stochastic parrot & vibe code useless things.
2muchtime 3 minutes ago [-]
I probably couldn’t (wouldn’t) run NixOS without it.
cute_boi 35 minutes ago [-]
We got lot of buggy sloppy softwares.
musicale 28 minutes ago [-]
homework cheating as a service at scale
malware on demand
an infinite slop generation firehose
Rendered at 00:01:26 GMT+0000 (Coordinated Universal Time) with Vercel.
The more detailed sources say, contra the mainstream impression, that Apple Silicon unified memory is technically a hybrid System-on-Chip and System-in-Package architecture. The memory banks DRAM are on a second die (one source said it is made by Samsung), but the RAM controller sits on the CPU die and manages the RAM for the unified memory pool for graphics/main/neural memory usage. Both IC dies coexists on a shared enclosed package as a single microchip. Technically this is still called a System-on-Chip architecture according to Wikipedia because the definition allows for parts, such as RAM or I/O, to still exist separately off the main piece of silicon die.
I have tried several times to find citations about this but it is a point that is often glossed over.
kids missing out on games - cz Switch prices went up.
regular joes - consumer hardware went up at least 50% from RAM, SSDs & other components
I guess regular joes gained the ability to 'chat' with a stochastic parrot & vibe code useless things.
malware on demand
an infinite slop generation firehose